Home Business Wire Cadence Joins Intel Foundry Services Ecosystem Alliance to Advance Chip Design Innovation

Cadence Joins Intel Foundry Services Ecosystem Alliance to Advance Chip Design Innovation

Cadence state-of-the-art EDA solutions and IP optimized for Intel process and packaging technologies

SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it has joined the new Intel Foundry Services (IFS) Ecosystem Alliance to support mutual customers with the development and delivery of innovative system-on-chip (SoC) designs. As a member of the alliance, Cadence is advancing adoption of Intel process and packaging technologies and Cadence® state-of-the-art digital, custom/analog, verification and advanced IC packaging EDA solutions, along with Cadence Design, Verification and Tensilica® IP. Using Intel and Cadence technologies, customers can accelerate time to market while reducing design barriers, risk and costs.

There are several benefits to joining the IFS Ecosystem Alliance. Cadence will have early access to process and advanced IC packaging roadmaps, process design kits (PDKs) and technical training. This allows the Cadence R&D teams to fine-tune EDA tools and IP for the Intel portfolio of process and packaging technologies so customers can meet power, performance and area (PPA) requirements.

“We’re collaborating with world-leading partners like Cadence to ensure our customers have access to a robust, comprehensive design ecosystem, process technologies, advanced packaging technologies and manufacturing capabilities,” said Dr. Randhir Thakur, president of IFS. “Cadence is constantly developing new solutions and IP to stay in front of customer demands, making them a critical ecosystem partner that aligns with our mission to address the growing global demand for chips with breakthrough SoC design technologies.”

“By joining the IFS Ecosystem Alliance, we’re demonstrating our commitment to ensuring that customers can quickly become proficient using Cadence solutions and IP supporting Intel process and packaging technologies,” said Dr. Anirudh Devgan, president and CEO of Cadence. “Our customers are under extreme pressure to deliver power-efficient and performance-optimized SoCs, and the Cadence and IFS collaboration lets our customers innovate with confidence.”

Cadence tools and IP support the company’s Intelligent System Design strategy, which enables customers to achieve SoC design excellence. For more information on Cadence advanced-node tools and IP, visit www.cadence.com/go/advancednodeifs.

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For seven years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2022 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

Category: Featured

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